Blogs

11 - 13 November 2025

MESSE STUTTGART (HALL 1), GERMANY

11 - 13 November 2025

MESSE STUTTGART (HALL 1), GERMANY

BLOGS

 

5 Trends Shaping the European Thermal Management Market in 2025

Date posted: May 2025

Our conversations with Thermal Management Expo attendees, exhibitors, conference speakers and other members of the broader thermal engineering community have offered valuable insights into the industry’s future directions.  

Here are five of the most important thermal management trends reshaping the market in Europe this year. 

 
 

 

Cloud Repatration Fuelling the Liquid Cooling Boom in Europe

Date posted: April 2025

The demands of artificial intelligence (AI), machine learning, and other compute-intensive workloads have fundamentally transformed how data centers are designed, built, and cooled. This shift has placed IT teams in the driver's seat when it comes to cooling decisions—marking a significant departure from three decades of established practices...

 
 

 

Cooling Innovations Enable Emergence of Commercial Electric Aviation in Island and Fjord Hopping

Date posted: August 2024

Although aviation is blamed for 3.5 percent of climate change, it is still the main missing puzzle piece in the promised carbon-free mobility future. Thermal challenges are standing in the way of commercial breakthroughs of fossil fuel-free, fully electric, rechargeable battery airplanes.  

 
 

 

Digital Twin Critical To Next Generation Thermal Management

Date posted: July 2024

Predictive thermal management (PTM) is emerging as one of the major trends in automotive technology this year. The Italian startup NEWTWEN is developing a software platform that generates digital twins of physical systems like electric motors and industrial power converters to run on the firmware of those systems. The platform provides virtual thermal sensors that can be used for real-time control improvements and optimisation. 

 
 

 
 

Thermal Management Key to Next-Generation Chips Breakthroughs

Date posted: July 2024

Semiconductor devices are going vertical. 3D chip stacking has already shown up in memory devices and smartphone cameras. Processors for artificial intelligence (AI) apply 2.5D technologies. Thermal challenges are the main bottleneck to wider commercialisation of true 3D integrated circuits (3D-ICs). 

 
 

 
 

Automotive OEMs and Suppliers in Race to Set Standard for Thermal Management Modules

 

Date posted: September 2023

Thermal management is critical to the development of electric vehicles (EV). To be able to deliver on consumer expectations, automotive OEMs and their suppliers have been focusing on integrating thermal management controls for the cabin, electric motor, batteries and power electronics into one optimised modular system.

 
 

 
 

Fast Charging Next-Generation EVs and Trucks Is A Major Thermal Challenge

 

Date posted: September 2023

With electric vehicle (EV) onboard chargers and DC fast-charging stations getting ever more powerful, managing heat in charger cables and systems is now the main potential point of failure. The industry has to mobilise resources to solve this bottleneck and scale up EV charging to the megawatt range.

 
 

 
 

What does the remainder of 2023 have in store for the polyurethane industry? 

 

Date posted: 2023

The 14-15 June saw the annual EUROPUR and EURO-MOULDERS conference in Budapest, Hungary. Over 500 delegates from across the polyurethane (PU) supply chain came together to discuss the latest industry trends and challenges.