SPEAKER INTERVIEW

Matt Evans, CEO of

Lennox Data Centre Solutions

Hi Matt, we’re delighted to have you as a speaker at this year’s Thermal Conference! To give yourself a bit of an introduction, could you briefly tell us about your current job role at LFB Group?

“Thank you! It’s great to be part of this year’s Thermal Conference, especially given how pivotal this moment is for the cooling and data centre sectors. I’m the CEO of Lennox Data Centre Solutions, part of the LFB Group (formerly known as Lennox EMEA).

“We launched just over a year ago to bring Lennox’s 60 years of HVAC and refrigeration expertise directly into the data centre space. My role is to ensure that our teams, which operate across Europe, are focused on engineering-led, collaborative solutions that help customers tackle the real challenges of high-density data centre design.”

Can you tell us anything about recent innovations over there at Lennox that are driving solutions to both HVAC challenges and climate control?

“We’re working hard to make thermal systems more efficient, adaptable and realistic for the future of high-density data centres. One example is our new Fan Wall Unit, which is part of our ApX Series. It might look familiar on the outside, but under the surface, it’s fundamentally different. It’s made from optimised sheet metal, with no unnecessary thickness or insulation.

“But the real innovation is in flexibility. We’ve created a modular product framework that allows us to tailor systems to specific applications without reinventing the wheel. This kind of design-led thinking—what I call engineered modularity—is what will enable cooling systems to evolve alongside AI-driven workloads that keep pushing the envelope on density and power demand.”

You are going to be speaking on Wednesday’s Opening Panel, ‘Transforming Cooling Strategies for High-Density Data Centre Design.’ Why is this such a hot topic in the thermal engineering sector?

“We’re living through the biggest design shift the industry has ever seen. Last year was a wild ride; AI workloads exploded and hyperscalers raced to expand capacity at an unprecedented rate. Now, some of that investment is being reassessed, but the engineering challenge hasn’t gone away.

“We’re talking about rack densities jumping from 20kW to 600kW in a few short years, and the conversation’s already shifting toward how we accommodate ultra-high-density systems like those driven by Nvidia’s 800V architecture.

“That’s not just incremental growth, that’s a total redefinition of how we design, power and cool data centres. Liquid cooling technologies, while they have existed for a long time, are now essential.”

What attracted you to speak at Thermal Management Expo Europe? What makes this event particularly relevant for the conversations happening in thermal management and control right now?

“Thermal Management Expo Europe is where the real conversations happen. The event gathers people who design, build and operate the infrastructure that powers everything from AI to the cloud. It’s the perfect forum to discuss not just what’s new, but what’s next.

“We’re at a crossroads where cooling isn’t a background discipline anymore. It’s a strategic driver of business decisions, site selection and investment models. Having the opportunity to engage with peers, challenge assumptions and share what we’re learning in real time makes this event invaluable.”

In your opinion, where do you see the future potential for data centres in the ever-growing world of Artificial Intelligence?

“AI is simultaneously the biggest opportunity and the biggest disruption we’ve ever seen. It’s compressing years of planned evolution into immediate action. Power densities have doubled and then doubled again. What used to be 10–15kW racks are now routinely 600kW or more.

“The potential lies in how we adapt. We’ll see hybrid facilities where air and liquid cooling coexist, and more modular architectures that can evolve with each generation of AI hardware. Interestingly, we may also see enterprises begin to repatriate workloads from the cloud to on-premises environments as they seek tighter control over their thermal and energy strategies.

“That’s going to open up a new wave of decentralised, application-specific data centres—and that’s incredibly exciting to me.”

Are there any sessions other than your own that you’re looking forward to attending?

“I’m really looking forward to the closing panel on day two; Breaking Speed and Accuracy Barriers With AI-Powered Thermal Modelling. I’m especially interested to hear from Jon Summers, Scientific Lead in Data Centres at RISE Research Institutes of Sweden.

“It’s such a relevant topic right now. As BEV development accelerates, keeping thermal simulations accurate and efficient is a real challenge. The idea that AI could simplify and speed up those processes is fascinating—and could save a lot of time (and sanity) along the way.”

What do you see as the most significant challenges the thermal management sector will face in 2026, and how is Lennox positioning itself to address these challenges for its customers?

“The number one challenge isn’t technology—it’s people. The industry is scaling faster than the talent pipeline can keep up, raising concern over a shortage of skilled engineers and technicians. With many experienced professionals nearing retirement, passing their expertise to the next generation is more critical than ever. That’s a long-term issue that every company needs to take seriously.

“From a technical perspective, we’re also entering a period of uncertainty. Everyone knows that AI workloads are growing, but no one knows how fast or how far they’ll go. We’re designing for densities that could double again in a year. So, flexibility and lifecycle thinking are critical. 

“At Lennox Data Centre Solutions, our goal is to remove chaos from our piece of the puzzle, and ensure our systems are reliable, adaptable and engineered with real-world constraints in mind.”

Finally, can you tell us why our visitors should make sure to set time aside during the event to attend your session?

“The session will explore what the next wave of innovation looks like. How scalable are today’s liquid cooling solutions? How adaptable are they to the unknown demands of tomorrow’s AI infrastructure? And perhaps, most importantly, do we need to move away from one-size-fits-all systems and start engineering truly application-specific, upgradable solutions?

“If you want an honest look at where data centre cooling is headed, and what it’ll take to get there, this panel is where those conversations will be happening.”