EXHIBITOR INTERVIEW

Duncan Bell, Managing Director, T-Global Technology

Can you tell us about your role at T-Global Technology and what your responsibilities entail? 

As Managing director for T-Global Technology Europe & North America Limited I am responsible for overseeing the day-to-day operation and continued growth of the company. Since taking over the role of MD in 2018 we’ve grown the business unit by 25% year on year. I’m responsible for managing the Sales and Marketing Teams and look after a couple of key accounts within the automotive sector which I managed prior to becoming MD. I enjoy the variety each day brings whether that’s working with customer’s R&D teams to solve complex thermal management challenges or working with our own R&D teams in Taiwan to develop next generation thermal interface materials but more on that later! 

T-Global Technology has established itself as a leading thermal management solutions provider. How has the company evolved over recent years, and what do you consider your most significant milestones? 

The company was founded in 2003 and has grown significantly since then, we now have 3 manufacturing bases located in Taiwan and Vietnam with plans to open more production facilities around the world in the near future. T-Global currently has 10 sales offices globally which enables us to provide a local level of service to our customers regardless of their location.  In terms of reducing lead times, a key milestone for us was appointing DigiKey as our authorised distributor which allowed us to hold stock that is ready to ship immediately after placing an order, prior to this all our materials were made to order at our manufacturing facilities. 

Could you share insights about your latest manufacturing capabilities and R&D investments? How are these enhancing your product offerings and customer service? 

I’d say our manufacturing capabilities are punching above our weight when compared to our larger competitors. For example, our average annual production quantity just for thermal pads alone is 86,400,000 which works out to almost 10,000 pads an hour and this is only set to increase with the development of additional manufacturing facilities. In addition to our core product range of gap pads we also develop and manufacture our own putties, pastes, greases and gels as well as heat pipes, vapour chambers and advanced thermal modules. R&D is at the heart of all we do, at our headquarters in Taiwan we have a research laboratory kitted out with a suite of 26 different test instruments to measure thermal performance, reliability and physical characteristics as well as electrical isolation, DBV and more. We also offer a free thermal simulation service to customers to identify and showcase a range of different solutions based on the initial brief and prototype design. In addition to our portfolio of material we are also able to provide our customers bespoke thermal management solutions which really does set us apart from other manufacturers. 

How would you describe T-Global Technology's position within the thermal management industry, particularly in sectors like electronics, automotive, and telecommunications? 

T-Global Technology has built a solid reputation for pioneering innovation in thermal management. With over 20 years’ experience of manufacturing thermal interface materials, a dedicated team of experienced engineers and researchers coupled with state-of-the-art R&D and production facilities, we are constantly pushing the boundaries of thermal management for both existing and emerging technologies. T-Global Technology successfully addresses the challenges of effective heat dissipation faced by manufacturers worldwide to ensure optimum functionality and longevity for industrial applications within the most demanding conditions. 

The consumer electronics industry is booming and slows no sign of slowing as the demand for devices continues to grow. The electronics industry is ultra-competitive with more focus being put on powerful performance alongside sleek and lightweight designs. Effective thermal management and heat dissipation are key to product performance, energy efficiency and device longevity. 

Within the automotive the demand for cutting-edge thermal management products has become more critical than ever following the explosion of the EV market. Effective thermal management is a crucial aspect of car design, ensuring optimal performance, safety, and longevity of components. T Global Technology has proved to be a global industry leader, providing some of the best thermal management solutions for automotive OEMs worldwide. 

In the ever-evolving world of telecommunications technology, thermal management is a critical aspect that ensures the reliability and longevity of both the network infrastructure and end user devices. With higher data transmission speeds and increased network density, these devices generate more heat, which can impact their performance and lifespan. 

T-Global Technology successfully addresses the challenges of effective heat dissipation faced by manufacturers worldwide to ensure optimum functionality and longevity for industrial applications within the most demanding conditions. 

As a sponsor of Thermal Management Expo Europe 2025, why is investing in events like this important for T-Global Technology? 

Investing in events like this is important to us for a number of reasons. It enables us to showcase our products and services to the right audiences and provides a platform for us to forge new business relationships as well reconnecting ‘in-person’ with existing contacts and customers. This is our second year at TMEE and we’ve found that the industry focus and size and scale of the event is just right for us, not only for the reasons listed previously but also because it enables us to keep up to date with the latest industry developments and challenges for all things thermal management. 

How is T-Global Technology addressing the evolving needs of high-performance computing and electric vehicle industries, particularly regarding heat dissipation and thermal efficiency challenges? 

I’d touched upon some of the challenges facing the automotive, electronics and telecoms industries earlier, we’re also seeing the supply chain demand for servers growing rapidly, which isn’t surprising given that they are the backbone of all digital communications. To help support the growth of these industries and ensure devices and components are performing reliably T-Global invests heavily into R&D to deliver next gen thermal management solutions. One example of this is the launch of our innovative TG-AD Series of hybrid gap fillers which bridges the gap between a pad and putty.  The AD series is an ultra-soft thermal pad line engineered to perform with the conformability of a putty whilst retaining the cleanliness, stability, and ease-of-use of a pad format. These pads achieve Shore 00 hardness values of 20-25, making them one of the softest thermally conductive materials available in sheet form. For thermal engineers seeking to optimise both performance and production throughput, the traditional consideration of thermal pads vs thermal putty is becoming less important. The TG-AD Series offers an ideal middle ground that behaves like a putty in pad form, delivering soft, highly conformable materials that can accommodate wide tolerances without sacrificing thermal conductivity. By adopting materials like TG-AD75, TG-AD66 or TG-AD30 OEMs can simplify assembly processes, reduce rework and QC inspection times, and extend product longevity - without compromising on thermal design margins. 

What do you see as the most significant challenges facing the thermal management industry through 2026, and how is T-Global Technology positioning itself to address these challenges? 

I would say that the most significant challenge facing the thermal management industry through 2026 is the explosive rise of AI and data-centre workloads. AI accelerators and high-density servers are driving unprecedented power and heat densities, pushing conventional cooling methods to their physical limits and accelerating the industry’s transition to liquid cooling. At the same time, operators must meet stricter regulatory and sustainability targets, making it essential to strike the right balance of performance, reliability, and environmental responsibility. 

T-Global Technology is positioning itself at the centre of this shift by developing its broad portfolio of advanced thermal interface materials with next-generation liquid cooling solutions. By offering rapid prototyping, localised engineering support, and simulation-driven co-design, T-Global enables customers to bring AI-ready and IoT-scaled platforms to market faster and with lower risk. With a focus on compliance, sustainability, and innovation, we provide thermal management solutions to enable data-centre and OEM partners to run cooler, faster, and greener. 

How does T-Global Technology approach bespoke thermal solution development for clients with specialised application requirements? 

As well as providing our customers with bespoke product formulations for thermal interface materials and advanced custom thermal modules, we also provide a free thermal simulation service which can be used for any electronic product to reduce R&D costs and save time on production schedules.   

Our high-quality thermal analysis report will help to optimise system configuration within your budget and any designs provided will be protected under a strict confidentiality agreement, ensuring our customer’s intellectual property remains secure. 

Why should attendees visit the T-Global Technology stand at this year's Thermal Management Expo Europe in Stuttgart? 

Come and visit T-Global Technology on stand 939 at Thermal Management Expo Europe to pick up your free thermal interface material sample kit, meet the team, find out about our latest product offerings and challenge us to solve your burning thermal management issues.