WEBINAR
EXCLUSIVE WEBINAR:
EXPLORING THERMAL CHALLENGES IN 3D INTEGRATED CIRCUITS (3D-IC)
Thursday 18 July, 2024 // 11AM CET
The trend in semiconductor devices is to go vertical; stack multiple chips into one single package. 3D integrated circuits (3D-ICs) have already entered the market in memory devices like 3D NAND flash. Leading semiconductor companies have used the concept in some products and foundries like TSMC are investing in 3D-IC capabilities.
One of the main bottlenecks to broader application of 3D-ICs is dissipating the heat built up by the increased power density in the stacked layers. Variations in temperatures between layers and regions in the stack can also cause thermal gradients, leading to expansion differences and mechanical stress, potentially breaking interconnects.
In this eye-opening webinar leading specialists will explore possible solutions to the thermal challenges in 3D-ICs, from microfluidic cooling and improvements in thermal interface materials to the role thermal simulation and modelling could play in rethinking the design for semiconductor devices and microelectronics.
Questions to be discussed:
- What improvements in thermal interface materials could accelerate 3D-IC development?
- What manufacturing process challenges need to be solved for 3D-ICs?
- What are the benefits and limitations of microfluidic cooling as a solution?
- Who are the main players driving innovation in 3D-IC development?
Speakers:
- Cor Rops, Senior Scientist Thermal and Fluidic Engineering, TNO
- Jason Hoffman-Bice, Co-founder and CEO, Fourier LLC
- Herman Oprins, R&D Team Leader Thermal Modeling, Imec
Moderator:
- Lieven Vervecken, Founder & CEO at Diabatix
JOIN US AT THERMAL MANAGEMENT EXPO EUROPE
(STUTTGART, GERMANY, 3-5 DECEMBER 2024)
This webinar is just a taste of the thermal engineering challenges that will be discussed at the conference at Thermal Management Expo Europe in Stuttgart, Germany (3-5 December 2024). The conference will run alongside a free to attend trade fair, view the exhibitor list for more details.