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Thermal Management Key to Next-Generation Chip Breakthroughs
Semiconductor devices are going vertical. 3D chip stacking has already shown up in memory devices and smartphone cameras. Processors for artificial intelligence (AI) apply 2.5D technologies. Thermal challenges are the main bottleneck to wider commercialisation of true 3D integrated circuits (3D-ICs).
Conference corner
In 2024, the Thermal Management Expo Europe conference sessions explored the pros and cons of cooloing strategies for 3D stacked semiconductor devices, the possibilities of bio-based adhesives within the high purity standards of microelectronics, as well as the relationship between cooling, heat dissipation and performance in electronics.
- Solving Thermal Challenges in Next-Generation 3D Stacked Semiconductor Devices
- Optimising Microelectronics Manufacturing with Next-Generation Adhesives & Thermal Materials
