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Thermal Management Key to Next-Generation Chip Breakthroughs
Semiconductor devices are going vertical. 3D chip stacking has already shown up in memory devices and smartphone cameras. Processors for artificial intelligence (AI) apply 2.5D technologies. Thermal challenges are the main bottleneck to wider commercialisation of true 3D integrated circuits (3D-ICs).
Conference corner
Attend the conference at Thermal Management Expo Europe 2024 to discover the pros and cons of cooloing strategies for 3D stacked semiconductor devices, the possibilities of bio-based adhesives within the high purity standards of microelectronics, as well as the relationship between cooling, heat dissipation and performance in electronics.
Visit the conference
Hear experts share insights on supply chain collaboration, material innovation, product development, manufacturing optimisation and sustainability. Speaking organisations include Stirweld, Henkel, Newtwen and Virtual Vehicle Research.
See what's on
Beyond the exhibition and conference, your free pass offers additional benefits. Immerse yourself in networking receptions, explore the solutions innovation stage, discover eco-conscious product listings, and much more!
Register for free
Your competitors will be at Thermal Management Expo Europe. Will you?
Join us in Stuttgart, 3-5 December to power ahead of your competition!